? 2006 cts corporation. all rights rese rved. information subject to change cts electronic components page 1 april 08 www.ctscorp.com vme64 & VME64X terminators vme64, VME64X terminator technical data sheet rohs compliant parts available typical applications VME64X backplane card card card card rt 2211 3.3v rt2211 3.3v standard termination vme64 +5v rt2210 330 low voltage termination VME64X +3.3v 1.8k 220 470 rt2211 features ? 8-bit termination network ? vme64, VME64X compliant ? low channel capacitance ? laser trimmed resistance to 1% ? slim bga package ? rohs compliant designs available ? compatible with both lead and lead free processes description this thevenin termination network provides high performance resistor termination for vme64 and VME64X back planes. designed with a ceramic substrate, this device minimizes parasitic capacitance and inductance, a primary cause of reduced system performance. in addition, the bga package eases touting design, saving the designer many hours of printed circuit layout. the bga packaging has been proven to reduce rework and improve reliability style g de f abc gh 1 2 3 r1 r2 electrical specifications resistor tolerance: 1.0% tcr 200ppm/ c operating temperature range -55 c to +125 c maximum resistor power: 0.05 watts at 70 c maximum package power: 1.0 watts at 70 c process requirements: maximum re-flow temperature per ipc/jedec j-std-020c ordering information standard part no. r1 r2 array size pitch (mm) rohs part no. rt1210b7 330 470 3 x 8 1.00 rt2210b7 rt1211b7 220 1800 3 x 8 1.00 rt2211b7 packaging information suffix tr7 tr13 tape width 24 mm 24mm carrier pitch 8 mm 8 mm reel diameter 7 inch 13 inch parts/reel 1,000 4,000 part number coding 7 inch reel, add tr7 to part number, example rt2210b7tr7 13 inch reel, add tr13 to part number, example rt2210b7tr13 (bulk packaging is not available) direction of feed
? 2006 cts corporation. all rights rese rved. information subject to change cts electronic components page 2 april 08 www.ctscorp.com vme64 & VME64X terminators complete clearone product, processing, and application information can be found at the following link: http://www.ctscorp.com/components/clearone.asp recommended land pattern 1.00 mm pitch (b7) = 0.51mm/.020 inch outline of substrate pcb pad diameter for .006" thick solder paste stencil, aperture opening should be equal to the pcb pad diameter. refer to www.ctscorp.com/components/clearone.asp for additional pcb design information blind vias to ground reference pla ne layer recomme nded o n every oth er row as shown. blind vias to v cc reference pla ne layer recomme nded o n every oth er row as shown. b l i n d vi a s to gr o u n d reference plane layer recommended on every other row as shown. vias to vcc termination island solder mask is used to define th e ba l l pa d s . bga routing schemes option a option b solder mask dia = pad diameter +.15mm (.006 inch) mechanical diagram k p (pitch) l w h p (pitch) a 1 identifie r rt_2__b7 cts yrwk d 1.0mm pitch l w h p d k mm 8.00 0.15 3.00 0.15 1.19 0.15 1.00 0.25 0.64 0.05 0.50 0.25 rt1210b7 rt1211b7 rt2210b7 rt2211b7 inch .315 .006 .118 .006 .047 .006 .039 .010 .025 .002 .020 .010
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